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8. Nion U-HERMES 100

• Operation Voltage: 30kV, 60kV, 100kV; 
• Special resolution: 0.1nm; 
• EELS energy resolution: 8meV; 
• Fully optimized for the low HT performance; 
• Ultra stable stage: drift <0.3nm/min; 
• Ultra high vacuum in sample chamber; 
• Electron direct detector for EELS and 4D STEM.


7. JEOL GRANDARM2

• CFEG with new Delta corrector; 

• 40, 80, 200, 300 keV; 

• 0.53 Å spatial resolution @300 kV; 

• 1.2 Å spatial resolution @40 kV; 

• Optimized for EDS analysis; 

• SAAF camera for DPC imaging; 

• 4D STEM; In-situ capabilities; 

• LN2 cooling holder.


6. Helios G4 SEM/FIB

• High resolution imaging for SEM: 1nm;
• Multiple detectors available: ETD/TLD/MD/ICD/BSD;
• Beam deceleration with stage bias; 
• Ultra low voltage and Charge Neutralizer for isolator samples; 
• Focused ion beam for microfabrication; 
• Pt and C CVD introduced by FIB/SEM; 
• EasyLift™ for precise in situ sample manipulation;
• EDS and EBSD.


5. JEM-2100Plus TEM

• LaB6 source filament; 

• Operation Voltage: 80 kV, 100 kV, 120 kV, 160 kV, 200 kV; 

• TEM, BF/DF imaging, SAED, CBED, NBD, EDS; 

• Cs: 1.0 nm; Cc: 1.4 nm; 

• Probe size: 20-200nm for TEM; 

• 1.0-25nm for CBED/NBD/EDS; 

• Lattice resolution: 0.14 nm; 

• Point resolution: 0.23 nm; 

• Tilt ±35/30° degrees on two axes; 

• In-situ capabilities.


4. Raman Spectrometer WITec-alpha300R

• High spectral resolution: ~1.5 cm-1;

• SHG high spatial resolution imaging; 

• Laser power continuously adjustable: 0.1 mW; 

• Raman low wavenumber: 60 cm-1; 

• Confocal high sensitivity: 30:1; 

• Pinhole confocal system; Fast imaging: 10 ms; 

• High lateral optical resolution: 350 nm; 

• High-precision fully automatic mechanical platform: 25 nm; 

• 532 nm excitation light; 

• 1064 nm pulsed laser.


3. In-situ holders

• Fig.①:Liquid N2 cooling TEM sample holder;

• Fig.②:Multi-Field Coupling TEM sample holder;

• Fig.③:In-situ gas/heating TEM sample holder;

• Fig.④:Tomography TEM sample holder;

• Fig.⑤:In-situ nano mechanics testing TEM sample holder.



2. TEM sample preparation

• Fig.①:Multiprep system grinding/polishing;
• Fig.②:PIPS;
• Fig.③:Plasma cleaning system;
• Fig.④:2D material transfer system;
• Fig.⑤:Glove box;
• Fig.⑥:Spin processor.

1. CVD system

• Multi-temperature zone tube furnace (HF-kejing, OTF-1200X-III);

• High work temperature: 1200 °C;

• Temperature control accuracy: ±1 °C;

• High vacuum flange;

• Fast heating and cooling rates.



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